Santa Clara, CA and Kyoto, Japan, July 14, 2022 (GLOBE NEWSWIRE) — SEMIKRON, headquartered in Nuremberg, and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules. Recently, ROHM’s latest 4th generation of SiC MOSFETs has been fully qualified in SEMIKRON’s eMPack® modules for automotive use. Hence, both companies serve worldwide customers’ needs.
SEMIKRON announced it had secured a billion-Euro contract to supply their innovative eMPack® power modules to a major German car maker, beginning in 2025. The company developed a fully sintered assembly and connection technology ‘Direct Pressed Die’ (DPD). This enables extremely compact, scalable and reliable traction inverters. The eMPack® module technology has been specially designed for SiC-based converters of medium and high power in order to fully exploit the properties of the new semiconductor material. In addition, SEMIKRON provides evaluation boards for eMPack® that incorporate ROHM’s gate driver ICs, helping customers shorten the time required for evaluation and adoption. In the future, SEMIKRON also plans to use ROHM’s IGBTs in modules for industrial applications.
“Thanks to ROHM’s SiC technology, SEMIKRON’s innovative eMPack®- family of power modules is ready to make a significant contribution to reducing emissions through e-mobility,” says Karl-Heinz Gaubatz, CEO and CTO at…
