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It is currently expected that MediaTek Dimensity 9000 Due to the use of cutting-edge technology, it will directly compete with this year’s flagship Dimensity 1200, and the cost will be much higher than this year’s flagship Dimensity 1200. Qualcomm Snapdragon 8 Gen1.
Last week, MediaTek confirmed that it will launch a new Dimensity 8000 chipset, which will be a low-cost alternative to MediaTek Dimensity 9000.
Some basic details of Dimensity 8000 have been exposed.It seems that it will provide some incremental improvements to excellence Dimensions 1200 At the same time retain the attractive prices associated with MediaTek phones.
Manufacturing process
The new chip will use TSMC’s 5-nanometer process, which is an upgraded version of the 6-nanometer process used by the Dimensity 1200, and is comparable to other flagship chipsets in 2021. But it is not as advanced as Dimensity 9000’s 4nm process and will be used.
CPU
Dimensity 8000 will stick to the older CPU design, using ARMv8 ARM Cortex-A78 CPU running at 2.75 GHz, and then using Cortex-A55 running at 2.0 GHz.
The single-core operating frequency of MediaTek Dimensity 1200 is 3 Ghz, but the other A78 cores all run at 2.6Ghz, while the A55 cores all run at the same 2.0 GHz.
Therefore, Dimensity 8000 should provide better multi-core performance, but may not have exactly the same peak performance. Improved manufacturing process should enable it to have improved continuous performance.
Dimensity 9000 is fully compliant with the specifications, the large and medium cores use the new Cortex X2 and A710, and the small core uses A510.
Therefore, the Dimensity 9000 will be much more powerful than the 8000, but as we saw the chipset this year, it may encounter thermal throttling issues. It is hoped that TSMC’s 4nm process will not have problems with the Samsung 5nm used by Qualcomm and Samsung this year.
Graphics processor
The GPU in Dimensity 8000 is the new mid-range Mali-G510 MC6. It is said that this should have a 100% performance improvement, which will use the new 3rd generation Valhall architecture instead of the 1st generation compared with the ARM Mali-G57.
For reference, it is Size 800U Implemented ARM Mali-G57 but only 4 clusters and Kirin 820 The Mali-G57 MP6 design is used. Kirin 820 scored 6327 points in 3DMark Sling Shot (ES 3.0) Unlimited Graphics and 55fps in GFXBench 3.0 Manhattan
MediaTek Dimensity 1200 uses Arm Mali G77 MC9. This reached 11770 in 3DMark Sling Shot (ES 3.0) Unlimited Graphics and 106fps in GFXBench 3.0 Manhattan.
If the 100% improvement is accurate, the performance of Dimensity 8000 is likely to exceed 1200.
Dimensity 9000 again uses one of the best specifications available for the ARM Mali-G710 MC10. Meditek recently demonstrated some benchmark tests of the new chip, which manages 238 fps GFXBenc v3.0 Manhattan. This may be twice the performance of Dimensity 8000.
MediaTek Dimensity 9000 vs 8000 vs 1200 Spec Sheet
| MediaTek Dimensity 9000 | MediaTek Dimensity 8000 | MediaTek Dimensity 1200 | |
|---|---|---|---|
| Manufacturing process | 4nm TSMC | 5nm TSMC | 6 nm |
| CPU | 1 x Arm Cortex-X2 @ 3.05 GHz 3 x ArmCortex-A710 @ 2.85 GHz 4 x Arm Cortex-A510 @ 1.8 GHz |
4x ARM Cortex-A78 @ 2.75 GHz 4x ARM Cortex-A55 @ 2.0 GHz |
1 x Arm Cortex A78 @ 3.0Ghz 3 x Arm Cortex A78 @ 2.6Ghz 4 x Arm Cortex A55 @ 2Ghz |
| Graphics processor | ARM Mali-G710 MC10 | Mali-G510 MC6 GPU | Arm Mali G77 MC9 |
| Artificial Intelligence/Neural Network | 5th generation 4+2 core APU | To be determined | Auxiliary Power Unit 3.0 |
Other bits
Some other little information about Dimensity 8000 revealed by MediaTek is that it supports 168Hz display with a resolution of 1080p+, a resolution of 120Hz, and a resolution of 1440p+. For memory, it can be connected to LPDDR5 and UFS 3.1.
The Dimensity 8000 chipset will be used in mobile phones in 2022, and Realme has confirmed its interest in using this chipset.
